Mark D. Poliks
SUNY Distinguished Professor; Professor of Empire Innovation; Undergraduate Director; Director
School of Systems Science and Industrial Engineering; Center for Advanced Microelectronics Engineering (CAMM)
Background
Mark D. Poliks is a Professor of Empire Innovation, a professor of Systems Science and Industrial Engineering, a professor of Materials Science and Engineering, and director of the Center for Advanced Microelectronics Manufacturing (CAMM, A New York State Center of Advanced Technology) at 绿帽社, State University of New York.
In 2006, he established CAMM to explore the application of roll-to-roll processing methods, including large-area photolithography, to flexible electronics and displays, with equipment funding from the U.S. Display Consortium (USDC) and the Army Research Lab. His research is in the areas of industry relevant topics that include high-performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability.
He has received more than $20 million in research funding from federal, New York state and corporate sources, and more than $30 million in equipment funding from federal and state sources. He is the recipient of the SUNY Chancellor鈥檚 Award for Excellence in Research.
He leads the New York State Node of the DoD NextFlex Manufacturing USA and was named a 2017 NextFlex Fellow. He has authored more than 100 technical papers and holds 48 U.S. patents. Previously he held senior technical management positions at IBM Microelectronics and Endicott Interconnect.
Poliks is a member of technical councils for the FlexTech Alliance, NBMC and NextFlex, and on the NextFlex Governing Council. He is an active member of the IEEE Electronics Packaging Society Electronic Component and Technology Conference and served and the 69th ECTC general chair.
Poliks received dual undergraduate degrees, with honors, in chemistry and mathematics from the University of Massachusetts, and a PhD from the University of Connecticut in materials science and engineering. He was a McDonnell-Douglas post-doctoral fellow working on solid-state magnetic resonance at Washington University in St. Louis before starting his career at IBM.
Education
- BS, University of Massachusetts
- MS, PhD, University of Connecticut
Research Interests
- Electronic materials
- Electronics packaging
- Flexible electronics and roll-to-roll manufacturing
- Additive manufacturing
- Sensory systems